Line Cards featuring Filtering Solutions, Circuit Protection Devices and Engineering Kits are also available. Call you EIL Representative for more information.

Advanced Interconnections (U.S.A.)
(Screw-Machine Type Socket & BGA Socket. )

Ball Grid Array (BGA) Socketing Systems

solutions for SMT and Thru-hole production or test applications 
same footprint as device 
process yields equivalent to direct attach 
eutectic solder balls reflow at standard SMT process profiles 
Pin Grid Array (PGA) Sockets and Adapters 

Durable construction for surface mount and thru-hole applications 
Wide variety of body materials and terminals available 
Cost-effective method of socketing PGA devices for future replacement, repair or upgrade 
Low insertion force (LIF) contacts 
Custom designs available 

Board to Board Interconnections

Available in .050Ħħ (1.27mm), .079Ħħ (2mm), and .100Ħħ (2.54mm) pitch 
High density, low-profile interconnects 
High quality screw-machined terminals offer reliable electrical/mechanical interconnects 
Wide variety of terminals and plating options 
Mezzanine board applications 
Unique solder preform terminals allow multi-tier Z-axis expansion

Please browse the website of Advanced Interconnections for detailed product information.